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✅ High quality thermal compound paste with silver addition, does not conduct electricity. ✅ Cooling paste is intended to fill the processor - heat sink connections to improve heat dissipation ✅ Thermal paste PC application: Systems used in PCs, laptops and other electronics: CPUs (between the heat sink and the CPU), graphics cards (between the heat sink and the GPU), chipsets (between the heat sink and North Bridge and South Bridge), power sections and among other heating circuits in widely used electronics ✅ Thermal paste kit thermal conductivity: > 4.8 W/mK ✅ Thermal paste does not conduct electric current - does not cause short circuit on very sensitive electronic circuits