In this book, Si/PPy-Cu composite materials were developed using two approaches. After studying the electrodeposition of polypyrrole onto an n-doped silicon electrode using various electrochemical methods, copper was deposited either by direct electroreduction or by immersion reduction of copper cations into the polymer film to form metallic copper. These materials were then characterized using electrochemical, spectroscopic, and microscopic analysis techniques, as well as conductivity measurements.
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