Extreme Ultraviolet Lithography: Second Edition

This book provides a comprehensive introduction to the principles, history, and core technologies of extreme ultraviolet lithography (EUVL), the semiconductor manufacturing technology that has enabled continued device scaling. It explains why EUVL was pursued, why a wavelength of 13.5 nm was selected, and how its key components including reflective optics, Mo/Si multilayer mirrors, masks, light sources, and resist materials were developed. The book also traces the evolution of EUVL from early research to high-volume manufacturing, highlighting the breakthroughs in multilayer coatings, ultra-precise aspherical mirror fabrication, and sub-nanometer metrology that made the technology practical. It concludes with the performance of modern production tools and the successful adoption of EUVL for advanced semiconductor fabrication at the 7 nm technology node and beyond.