Adsorption and Kinetic Study of Copper (II) Ion by Kaolin
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This book summarizes the present study deals with the removal of copper ions by kaolin. The percentage removal of copper ions on Kaolin is found to decrease with increase in initial concentration of copper solution. Langmuir and Freundlich adsorption isotherms were tested and found to be applicable. Mono layer coverage of copper ions exists on the surface of this system. The percentage of removal of copper ions was found to increase with the increase in contact time. The optimum contact time was found to be 30 minutes. The kinetic equations like Natarajan-Khalaf, Venkobachar-Bhatacharya and Lagergren were found to be applicable. The percentage of removal of copper ions by adsorption on Kaolin was found to increase with increase in dose of adsorbent. This is due to increased number of active sites available on the surface of adsorbent. From this work, it can be concluded that Kaolin can be used as good adsorbent for the removal of copper ions from waste water.
This book summarizes the present study deals with the removal of copper ions by kaolin. The percentage removal of copper ions on Kaolin is found to decrease with increase in initial concentration of copper solution. Langmuir and Freundlich adsorption isotherms were tested and found to be applicable. Mono layer coverage of copper ions exists on the surface of this system. The percentage of removal of copper ions was found to increase with the increase in contact time. The optimum contact time was found to be 30 minutes. The kinetic equations like Natarajan-Khalaf, Venkobachar-Bhatacharya and Lagergren were found to be applicable. The percentage of removal of copper ions by adsorption on Kaolin was found to increase with increase in dose of adsorbent. This is due to increased number of active sites available on the surface of adsorbent. From this work, it can be concluded that Kaolin can be used as good adsorbent for the removal of copper ions from waste water.
AmazonPagina's: 52, Paperback, LAP LAMBERT Academic Publishing
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